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[IEEE 2017 IEEE Electron Devices Technology and Manufacturing Conference (EDTM) - Toyama, Japan (2017.2.28-2017.3.2)] 2017 IEEE Electron Devices Technology and Manufacturing Conference (EDTM) - BGA packaging process for a device made by minimal fab
Khumpuang, Sommawan, Imura, Fumito, Kara, ShiroYear:
2017
Language:
english
DOI:
10.1109/EDTM.2017.7947516
File:
PDF, 492 KB
english, 2017