Stability of stacking fault tetrahedron in twin boundary...

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Stability of stacking fault tetrahedron in twin boundary bicrystal copper under shear

Wu, Lianping, Yu, Wenshan, Hu, Shuling, Shen, Shengping
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Language:
english
Journal:
International Journal of Plasticity
DOI:
10.1016/j.ijplas.2017.06.005
Date:
June, 2017
File:
PDF, 5.15 MB
english, 2017
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