![](/img/cover-not-exists.png)
[IEEE 2017 5th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) - Tokyo, Japan (2017.5.16-2017.5.18)] 2017 5th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) - Optimized ultra-thin Manganin alloy passivated fine-pitch damascene compatible Cu-Cu bonding at sub 200°C for 3D IC integration
Panigrahi, Asisa Kumar, Kumar, C. Hemanth, Ghosh, Tamal, Vanjari, Siva Rama Krishna, Singh, Shiv GovindYear:
2017
Language:
english
DOI:
10.23919/ltb-3d.2017.7947431
File:
PDF, 326 KB
english, 2017