[IEEE 2017 5th International Workshop on Low Temperature...

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[IEEE 2017 5th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) - Tokyo, Japan (2017.5.16-2017.5.18)] 2017 5th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) - Optimized ultra-thin Manganin alloy passivated fine-pitch damascene compatible Cu-Cu bonding at sub 200°C for 3D IC integration

Panigrahi, Asisa Kumar, Kumar, C. Hemanth, Ghosh, Tamal, Vanjari, Siva Rama Krishna, Singh, Shiv Govind
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Year:
2017
Language:
english
DOI:
10.23919/ltb-3d.2017.7947431
File:
PDF, 326 KB
english, 2017
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