[IEEE 2016 6th Electronic System-Integration Technology Conference (ESTC) - Grenoble, France (2016.9.13-2016.9.15)] 2016 6th Electronic System-Integration Technology Conference (ESTC) - Au-Sn Solid-Liquid Interdiffusion (SLID) bonding for mating surfaces with high roughness
Nguyen, Hoang-Vu, Tung Manh,, Eggen, Trym, Aasmundtveit, Knut E.Year:
2016
Language:
english
DOI:
10.1109/ESTC.2016.7764691
File:
PDF, 12.42 MB
english, 2016