Microstructural Modification of Sn-0.7Cu Solder Alloys by...

Journal of Electronic Materials 2017 / 8 Vol. 46; Iss. 8

Microstructural Modification of Sn-0.7Cu Solder Alloys by Fe/Bi-Addition for Achieving High Mechanical Performance

Bakhtiar Ali,Mohd Faizul Mohd Sabri,Suhana Mohd Said…
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Volume:
46
Language:
english
Journal:
Journal of Electronic Materials
DOI:
10.1007/s11664-017-5416-x
Date:
August, 2017
File:
PDF, 2.12 MB
english, 2017
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