Experimental Study of Energy Saving Performances in Chip...

Energy Procedia 2017 / 05 Vol. 105

Experimental Study of Energy Saving Performances in Chip Cooling by using Heat Sink with Embedded Heat Pipe

Zhu, Kai, Zheng, Mingzhu, Wang, Bin, Dai, Baomin, Wang, Yabo, Wei, Jie, Chen, Xiaoqing
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Volume:
105
Language:
english
Journal:
Energy Procedia
DOI:
10.1016/j.egypro.2017.03.1046
Date:
May, 2017
File:
PDF, 748 KB
english, 2017
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