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[IEEE 2016 6th Electronic System-Integration Technology Conference (ESTC) - Grenoble, France (2016.9.13-2016.9.15)] 2016 6th Electronic System-Integration Technology Conference (ESTC) - Numerical analysis of thermal effects in SOI MOSFET Flip-Chip packages: Multi-scale studies on isolated transistors and global simulations
Garegnani, Giacomo, Fiori, Vincent, Gallois-Garreignot, Sebastien, Gonella, RobertoYear:
2016
Language:
english
DOI:
10.1109/ESTC.2016.7764703
File:
PDF, 17.52 MB
english, 2016