Analysis of Metal Wire Effect on Temperature Distribution...

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IEEE Transactions on Semiconductor Manufacturing 2017

Analysis of Metal Wire Effect on Temperature Distribution in Stacked IC with Thinned Chip

Matsuda, Toshihiro, Demachi, Haruka, Iwata, Hideyuki, Hatakeyama, Tomoyuki, Ohzone, Takashi
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Year:
2017
Language:
english
Journal:
IEEE Transactions on Semiconductor Manufacturing
DOI:
10.1109/tsm.2017.2720620
File:
PDF, 2.37 MB
english, 2017
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