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[IEEE 2017 5th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) - Tokyo, Japan (2017.5.16-2017.5.18)] 2017 5th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) - Low-temperature solder bonding and thin film encapsulation for wafer level packaged MEMS aiming at harsh environment
Lee, ChengkuoYear:
2017
Language:
english
DOI:
10.23919/LTB-3D.2017.7947408
File:
PDF, 643 KB
english, 2017