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Effects of rapid solidification process and 0.1%Pr/Nd addition on characteristics of Sn−9Zn solder alloy and interfacial properties of Cu/solder/Cu joints
Guo-ji Zhao 赵国际,Guang-hua Wen 文光华…Volume:
23
Language:
english
Journal:
Journal of Central South University
DOI:
10.1007/s11771-016-3237-3
Date:
August, 2016
File:
PDF, 3.23 MB
english, 2016