Effect of Nd on whiskers growth behavior of SnAgCu solders...

Journal of Materials Science: Materials in Electronics 2016 / 9 Vol. 27; Iss. 9

Effect of Nd on whiskers growth behavior of SnAgCu solders in electronic packaging

Zhang, Liang, Yang, Fan, Zhong, Su-juan
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Volume:
27
Language:
english
Journal:
Journal of Materials Science: Materials in Electronics
DOI:
10.1007/s10854-016-5012-5
Date:
September, 2016
File:
PDF, 1.22 MB
english, 2016
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