Heterogeneous Stress Relaxation Processes at Grain Boundaries in High-Sn Solder Films: Effects of Sn Anisotropy and Grain Geometry During Thermal Cycling
Wei-Hsun Chen,Pylin Sarobol,Carol A. Handwerker,John E. BlendellVolume:
68
Language:
english
Journal:
JOM
DOI:
10.1007/s11837-016-2070-3
Date:
November, 2016
File:
PDF, 2.89 MB
english, 2016