Wafer size effect on material removal rate in copper CMP process
Minjong Yuh,Soocheon Jang,Inho Park…Volume:
31
Language:
english
Journal:
Journal of Mechanical Science and Technology
DOI:
10.1007/s12206-017-0539-9
Date:
June, 2017
File:
PDF, 2.15 MB
english, 2017