Electrical Modeling and Analysis of Differential...

IEEE Microwave and Wireless Components Letters 2017 / 7 Vol. 27; Iss. 7

Electrical Modeling and Analysis of Differential Dielectric-Cavity Through-Silicon via Array

Liu, Xiaoxian, Zhu, Zhangming, Yang, Yintang, Ding, Ruixue, Li, Yuejin
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Volume:
27
Language:
english
Journal:
IEEE Microwave and Wireless Components Letters
DOI:
10.1109/LMWC.2017.2711563
Date:
July, 2017
File:
PDF, 459 KB
english, 2017
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