Design and characterization of a 3D encapsulation with...

Chinese Physics B 2017 / 06 Vol. 26; Iss. 6

Design and characterization of a 3D encapsulation with silicon vias for radio frequency micro-electromechanical system resonator

Zhao, Ji-Cong, Yuan, Quan, Wang, Feng-Xiang, Kan, Xiao, Han, Guo-Wei, Sun, Ling, Sun, Hai-Yan, Yang, Jin-Ling, Yang, Fu-Hua
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Volume:
26
Language:
english
Journal:
Chinese Physics B
DOI:
10.1088/1674-1056/26/6/060705
Date:
June, 2017
File:
PDF, 492 KB
english, 2017
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