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[IEEE 2017 IEEE International Reliability Physics Symposium (IRPS) - Monterey, CA, USA (2017.4.2-2017.4.6)] 2017 IEEE International Reliability Physics Symposium (IRPS) - ATE and lock-in thermography coupling techniques for a 3D defect localization in a 4-stacked die memory
Courjault, Nicolas, Sanchez, Kevin, Messager, Fabien, Infante, FulvioYear:
2017
Language:
english
DOI:
10.1109/IRPS.2017.7936372
File:
PDF, 1.71 MB
english, 2017