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[IEEE 2016 IEEE International 3D Systems Integration Conference (3DIC) - San Francisco, CA, USA (2016.11.8-2016.11.11)] 2016 IEEE International 3D Systems Integration Conference (3DIC) - Through-substrate via (TSV) with embedded capacitor as an on-chip energy storage element
Lin, Ye, Seng Tan, ChuanYear:
2016
Language:
english
DOI:
10.1109/3DIC.2016.7970003
File:
PDF, 497 KB
english, 2016