[IEEE 2016 17th International Conference on Electronic Packaging Technology (ICEPT) - Wuhan, China (2016.8.16-2016.8.19)] 2016 17th International Conference on Electronic Packaging Technology (ICEPT) - PEM/OBIRCH in failure localization of flip-chip
Sun, Zhe, Chen, Xuanlong, Lin, DaotanYear:
2016
Language:
english
DOI:
10.1109/icept.2016.7583355
File:
PDF, 645 KB
english, 2016