[IEEE 2017 5th International Workshop on Low Temperature...

  • Main
  • [IEEE 2017 5th International Workshop...

[IEEE 2017 5th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) - Tokyo, Japan (2017.5.16-2017.5.18)] 2017 5th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) - Low-temperature direct bonding of silicon to quartz glass wafer via sequential wet chemical surface activation

Wang, Chenxi, Xu, Jikai, Zeng, Xiaorun, Tian, Yanhong, Wang, Chunqing, Suga, Tadatomo
How much do you like this book?
What’s the quality of the file?
Download the book for quality assessment
What’s the quality of the downloaded files?
Year:
2017
DOI:
10.23919/LTB-3D.2017.7947417
File:
PDF, 257 KB
2017
Conversion to is in progress
Conversion to is failed