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[IEEE 2017 5th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) - Tokyo, Japan (2017.5.16-2017.5.18)] 2017 5th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) - Low-temperature direct bonding of silicon to quartz glass wafer via sequential wet chemical surface activation
Wang, Chenxi, Xu, Jikai, Zeng, Xiaorun, Tian, Yanhong, Wang, Chunqing, Suga, TadatomoYear:
2017
DOI:
10.23919/LTB-3D.2017.7947417
File:
PDF, 257 KB
2017