[ASME ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems - Portland, Oregon, USA (July 6–8, 2011)] ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2 - TSV Interposers With Embedded Microchannels for 3D IC and LED Integration
Lau, John, Chien, Heng-Chieh, Tain, RayYear:
2011
Language:
english
DOI:
10.1115/IPACK2011-52204
File:
PDF, 1.17 MB
english, 2011