[ASME ASME 2015 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems collocated with the ASME 2015 13th International Conference on Nanochannels, Microchannels, and Minichannels - San Francisco, California, USA (Monday 6 July 2015)] Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales - Pre-Applied Inter Chip Fill for 3D-IC Chip Joining
Kawase, Yasuhiro, Ikemoto, Makoto, Sugiyama, Masaya, Yamamoto, Hidehiro, Kiritani, HidekiYear:
2015
Language:
english
DOI:
10.1115/IPACK2015-48738
File:
PDF, 3.65 MB
english, 2015