[IEEE 2017 40th International Convention on Information and Communication Technology, Electronics and Microelectronics (MIPRO) - Opatija, Croatia (2017.5.22-2017.5.26)] 2017 40th International Convention on Information and Communication Technology, Electronics and Microelectronics (MIPRO) - Structural integrity optimization of 3D TSV package by analyzing crack behavior at TSV and BEOL

The file will be sent to your email address. It may take up to 1-5 minutes before you receive it.

The file will be sent to you via the Telegram messenger. It may take up to 1-5 minutes before you receive it.

Note: Make sure you have linked your account to Z-Library Telegram bot.

The file will be sent to your Kindle account. It may take up to 1–5 minutes before you receive it.

Please note: you need to verify every book you want to send to your Kindle. Check your mailbox for the verification email from Amazon Kindle.