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Microelectronics Reliability 2017 / 7

Simulation of packaging under harsh environment conditions (temperature, pressure, corrosion and radiation)

Weide-Zaage, Kirsten
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Language:
english
Journal:
Microelectronics Reliability
DOI:
10.1016/j.microrel.2017.07.026
Date:
July, 2017
File:
PDF, 1.71 MB
english, 2017
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