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Thermal-Aware Microchannel Cooling of Multicore Processors: A Three-Stage Design Approach
Li, Yubai, Guo, Dongzhi, Yao, Shi-ChuneVolume:
136
Language:
english
Journal:
Journal of Electronic Packaging
DOI:
10.1115/1.4027174
Date:
April, 2014
File:
PDF, 3.45 MB
english, 2014