Experimental and Numerical Investigation of Interdie...

Journal of Electronic Packaging 2017 / 06 Vol. 139; Iss. 2

Experimental and Numerical Investigation of Interdie Thermal Resistance in Three-Dimensional Integrated Circuits

Choobineh, Leila, Jones, Jared, Jain, Ankur
How much do you like this book?
What’s the quality of the file?
Download the book for quality assessment
What’s the quality of the downloaded files?
Volume:
139
Language:
english
Journal:
Journal of Electronic Packaging
DOI:
10.1115/1.4036404
Date:
June, 2017
File:
PDF, 3.34 MB
english, 2017
Conversion to is in progress
Conversion to is failed