[IEEE 2017 18th International Conference on Thermal,...

[IEEE 2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Dresden, Germany (2017.4.3-2017.4.5)] 2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Simulation-driven development of a novel SiC embedded power module design concept

Yafan Zhang,, Neumaier, Klaus, Zschieschang, Olaf, Weis, Gerald, Schmid, Gerhard, Bakowski, Mietek, Nee, Hans-Peter

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Year:

2017

Language:

english

DOI:

10.1109/EuroSimE.2017.7926252

File:

PDF, 11.68 MB

english, 2017

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