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[IEEE 2017 5th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) - Tokyo, Japan (2017.5.16-2017.5.18)] 2017 5th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) - Bond strength of 3D-stacked monocrystalline silicon X-ray mirrors
Girou, D. A., Landgraf, B., Guenther, R., Collon, M. J., Beijersbergen, M. W.Year:
2017
DOI:
10.23919/LTB-3D.2017.7947410
File:
PDF, 115 KB
2017