[IEEE 2017 5th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) - Tokyo, Japan (2017.5.16-2017.5.18)] 2017 5th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) - Feasibility study on ultrafine-pitch Cu-Cu bonding using directed self-assembly (DSA)
Murugesan, M., Fukushima, T., Mori, K., Hashimoto, H., Bea, Jichel, Koyanagi, M.Year:
2017
Language:
english
DOI:
10.23919/LTB-3D.2017.7947440
File:
PDF, 533 KB
english, 2017