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[IEEE 2017 5th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) - Tokyo, Japan (2017.5.16-2017.5.18)] 2017 5th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) - Surface activated wafer bonding of LiNbO3 and SiO2/Si for LNOI on Si
Takigawa, Ryo, Higurashi, Eiji, Asano, TanemasaYear:
2017
Language:
english
DOI:
10.23919/LTB-3D.2017.7947443
File:
PDF, 4.29 MB
english, 2017