[IEEE 2017 5th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) - Tokyo, Japan (2017.5.16-2017.5.18)] 2017 5th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) - Electrical conduction of Si/ITO/Si junctions fabricated by surface activated bonding
Liang, Jianbo, Ogawa, Tomoki, Araki, Kenji, Kamioka, Takefumi, Shigekawa, NaoteruYear:
2017
Language:
english
DOI:
10.23919/LTB-3D.2017.7947447
File:
PDF, 439 KB
english, 2017