[IEEE 2017 5th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) - Tokyo, Japan (2017.5.16-2017.5.18)] 2017 5th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) - 2D material transfer using room temperature bonding
Matsumae, Takashi, Suga, TadatomoYear:
2017
Language:
english
DOI:
10.23919/LTB-3D.2017.7947451
File:
PDF, 383 KB
english, 2017