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[IEEE 2017 5th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) - Tokyo, Japan (2017.5.16-2017.5.18)] 2017 5th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) - Direct transfer of atomically smooth Au film onto electroplated patterns for room-temperature Au-Au bonding in atmospheric air
Kurashima, Y., Maeda, A., Takagi, H.Year:
2017
Language:
english
DOI:
10.23919/LTB-3D.2017.7947452
File:
PDF, 602 KB
english, 2017