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[IEEE 2017 5th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) - Tokyo, Japan (2017.5.16-2017.5.18)] 2017 5th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) - Integration of 200 mm Si-CMOS and III-V materials through wafer bonding
Lee, Kwang Hong, Bao, Shuyu, Lee, Kenneth Eng Kian, Fitzgerald, Eugene, Tan, Chuan SengYear:
2017
Language:
english
DOI:
10.23919/ltb-3d.2017.7947426
File:
PDF, 768 KB
english, 2017