High temperature MEMS packages: die-attach solutions for LiNbO3under low bonding pressures
Ali Roshanghias,Gudrun Bruckner…Volume:
28
Language:
english
Journal:
Journal of Materials Science: Materials in Electronics
DOI:
10.1007/s10854-017-6605-3
Date:
June, 2017
File:
PDF, 1.85 MB
english, 2017