Embed SRAM IDDOFF fail root cause identification by...

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Microelectronics Reliability 2017 / 7

Embed SRAM IDDOFF fail root cause identification by combination of device analysis and localized circuit analysis

Chen, C.Q., Ang, G.B., Ng, P.T., Rivai, Francis, Ng, H.P., Quah, A.C.T., Teo, Angela, Lam, Jeffery, Mai, Z.H.
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Language:
english
Journal:
Microelectronics Reliability
DOI:
10.1016/j.microrel.2017.07.015
Date:
July, 2017
File:
PDF, 2.45 MB
english, 2017
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