Laser-assisted Selective Activation of Injection Molded Chip Packaging Devices with Thermoset Substrate Materials for Intelligent Connectivity Systems in Automobiles
Kordass, Timo, Bachy, Bassim, Weisser, Mathias, Franke, JörgVolume:
63
Year:
2017
Language:
english
Journal:
Procedia CIRP
DOI:
10.1016/j.procir.2017.03.272
File:
PDF, 563 KB
english, 2017