Extended displacement discontinuity method for analysis of cracks in 2D thermal piezoelectric semiconductors
Zhao, MingHao, Pan, YiBo, Fan, CuiYing, Xu, GuangTaoVolume:
26
Language:
english
Journal:
Smart Materials and Structures
DOI:
10.1088/1361-665X/aa754d
Date:
August, 2017
File:
PDF, 885 KB
english, 2017