![](/img/cover-not-exists.png)
Rapid Solidification of Sn-Cu-Al Alloys for High-Reliability, Lead-Free Solder: Part I. Microstructural Characterization of Rapidly Solidified Solders
Reeve, Kathlene N., Choquette, Stephanie M., Anderson, Iver E., Handwerker, Carol A.Volume:
47
Language:
english
Journal:
Metallurgical and Materials Transactions A
DOI:
10.1007/s11661-016-3738-6
Date:
December, 2016
File:
PDF, 11.08 MB
english, 2016