Reaction mechanisms of copper electrodeposition from...

Materials Science and Engineering: B 2017 / 10 Vol. 224

Reaction mechanisms of copper electrodeposition from 1-hydroxyethylidene-1,1-diphosphonic acid (HEDP) solution on glassy carbon

Zheng, Jingwu, Chen, Haibo, Cai, Wei, Qiao, Liang, Ying, Yao, Li, Wangchang, Yu, Jing, Jiang, Liqiang, Che, Shenglei
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Volume:
224
Language:
english
Journal:
Materials Science and Engineering: B
DOI:
10.1016/j.mseb.2017.07.004
Date:
October, 2017
File:
PDF, 1.69 MB
english, 2017
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