Fine-Feature Cu/In Interconnect Bonding Using Single Sided...

IEEE Journal of the Electron Devices Society 2017 / 3 Vol. 5; Iss. 2

Fine-Feature Cu/In Interconnect Bonding Using Single Sided Heating and Chip-to-Wafer Bonding Technology

Lee, Shih-Wei, Chang, Ching-Yun, Chang, Geng-Ming, Chen, Kuan-Neng
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Volume:
5
Language:
english
Journal:
IEEE Journal of the Electron Devices Society
DOI:
10.1109/JEDS.2016.2645382
Date:
March, 2017
File:
PDF, 765 KB
english, 2017
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