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[ASME ASME 2015 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems collocated with the ASME 2015 13th International Conference on Nanochannels, Microchannels, and Minichannels - San Francisco, California, USA (Monday 6 July 2015)] Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales - DIC Based Investigation Into the Effect of Mean Temperature of Thermal Cycle on the Strain State in SnAgCu Solder Joint
Lall, Pradeep, Mirza, Kazi, Suhling, JeffYear:
2015
Language:
english
DOI:
10.1115/ipack2015-48727
File:
PDF, 7.24 MB
english, 2015