Reliability tests of electroless barriers against copper...

Japanese Journal of Applied Physics 2016 / 05 Vol. 55; Iss. 5

Reliability tests of electroless barriers against copper diffusion under bias-temperature stress with n- and p-type substrates

Ueno, Kazuyoshi, Fujishima, Shota, Yamashita, Makoto, Mitsumori, Akiyoshi
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Volume:
55
Language:
english
Journal:
Japanese Journal of Applied Physics
DOI:
10.7567/JJAP.55.056501
Date:
May, 2016
File:
PDF, 3.00 MB
english, 2016
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