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The Effects of Silica Fillers on the Properties of Encapsulation Molding Compounds
Liaw, Yowching, Chou, Jung-HuaVolume:
139
Language:
english
Journal:
Journal of Electronic Packaging
DOI:
10.1115/1.4037145
Date:
July, 2017
File:
PDF, 1.53 MB
english, 2017