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[IEEE 2017 Asia-Pacific International Symposium on Electromagnetic Compatibility (APEMC) - Seoul, South Korea (2017.6.20-2017.6.23)] 2017 Asia-Pacific International Symposium on Electromagnetic Compatibility (APEMC) - Design optimization of board-level signal integrity depending on PCB stack-up configuration in a mobile device

Kim, Inmu, Kim, Kipyoung, Cho, Youngmin, Song, Eakhwan
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Year:
2017
Language:
english
DOI:
10.1109/APEMC.2017.7975498
File:
PDF, 700 KB
english, 2017
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