[IEEE 2017 Asia-Pacific International Symposium on Electromagnetic Compatibility (APEMC) - Seoul, South Korea (2017.6.20-2017.6.23)] 2017 Asia-Pacific International Symposium on Electromagnetic Compatibility (APEMC) - Design optimization of board-level signal integrity depending on PCB stack-up configuration in a mobile device
Kim, Inmu, Kim, Kipyoung, Cho, Youngmin, Song, EakhwanYear:
2017
Language:
english
DOI:
10.1109/APEMC.2017.7975498
File:
PDF, 700 KB
english, 2017