[IEEE 2017 Symposium on Design, Test, Integration and...

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[IEEE 2017 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP) - Bordeaux, France (2017.5.29-2017.6.1)] 2017 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP) - Modeling of an out-of-plane capacitive MEMS transducer with dynamically coupled electrodes

Bosetti, Gabriele, Manz, Johannes, Schrag, Gabriele, Dehe, Alfons
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Year:
2017
Language:
english
DOI:
10.1109/DTIP.2017.7984459
File:
PDF, 1012 KB
english, 2017
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