A Study of Deformation Mechanism During Nanoindentation...

A Study of Deformation Mechanism During Nanoindentation Creep in Tin-Based Solder Balls

Shibutani, Tadahiro, Yu, Qiang, Shiratori, Masaki
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Volume:
129
Year:
2007
Language:
english
Journal:
Journal of Electronic Packaging
DOI:
10.1115/1.2429712
File:
PDF, 193 KB
english, 2007
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