A Study of Deformation Mechanism During Nanoindentation Creep in Tin-Based Solder Balls
Shibutani, Tadahiro, Yu, Qiang, Shiratori, MasakiVolume:
129
Year:
2007
Language:
english
Journal:
Journal of Electronic Packaging
DOI:
10.1115/1.2429712
File:
PDF, 193 KB
english, 2007