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Growth Kinetics of Intermetallic Compounds During Interfacial Reactions Between SnAgCuGa Lead-Free Solder and Cu Substrate
Chen, HuiMing, Shang, Genfeng, Hu, Wang Yi, Wang, HangVolume:
56
Language:
english
Journal:
Powder Metallurgy and Metal Ceramics
DOI:
10.1007/s11106-017-9877-5
Date:
May, 2017
File:
PDF, 2.35 MB
english, 2017