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Reliability investigation of the copper-zinc system for solid diffusion bonding in power modules

Dugal, Franc, Ciappa, Mauro
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Language:
english
Journal:
Microelectronics Reliability
DOI:
10.1016/j.microrel.2017.07.023
Date:
July, 2017
File:
PDF, 1.42 MB
english, 2017
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