XRD and ToF-SIMS study of intermetallic void formation in...

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Microelectronics Reliability 2017 / 7

XRD and ToF-SIMS study of intermetallic void formation in Cu-Sn micro-connects

Ross, G., Vuorinen, V., Krause, M., Reissaus, S., Petzold, M., Paulasto-Kröckel, M.
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Language:
english
Journal:
Microelectronics Reliability
DOI:
10.1016/j.microrel.2017.07.044
Date:
July, 2017
File:
PDF, 1.84 MB
english, 2017
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