A flexible and stackable 3D interconnect system using...

Flexible and Printed Electronics 2017 / 06 Vol. 2; Iss. 2

A flexible and stackable 3D interconnect system using growth-engineered carbon nanotube scaffolds

Jiang, Di, Sun, Shuangxi, Edwards, Michael, Jeppson, Kjell, Wang, Nan, Fu, Yifeng, Liu, Johan
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Volume:
2
Language:
english
Journal:
Flexible and Printed Electronics
DOI:
10.1088/2058-8585/aa6a82
Date:
June, 2017
File:
PDF, 2.08 MB
english, 2017
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